/ Desktop CPU Coolers / LGA1700/ LGA1800 1U, Passive BACK
LGA1700/ LGA1800 1U, Passive
Product Series -
1U Passive Coolers, TDP: 125 Watts (min.)
Features & Benefits -
A full range of products, high quality, high reliability, customization available
Target Market -
AI Edge Computing, Server Based IPC, High Performance Computing (HPC)
P/N : RGD3128-P2-002
TDP: 65W~125W
Outline Dimension : 88 x 88 x 25 mm
Heat Sink : Skived Copper Heat Sink
Thermal Resistance : 0.207℃/W @40CFM
Weight : 470 g
P/N : RGD3128VCL-P-002
TDP: 125W (min.)
Outline Dimension : 90 x 90 x 25mm
Heat Sink : Stacked Aluminum Fin with Vapor Chamber Base
Thermal Resistance : 0.150℃/W @ 40CFM
Weight : 210 g
P/N : RGD3128VC-P-002
TDP: 125W (min.)
Outline Dimension : 90 x 90 x 25 mm
Heat Sink : Stacked Copper Fin with Vapor Chamber Base
Thermal Resistance : 0.125℃/W @ 40CFM
Weight : 370 g
LGA1700/ LGA1800 1U, Passive
NO | Part Number | CPU Socket | Outline Dimension (mm) | Rth ℃/W | Fan Spec. | Heat Sink Material | DATA SHEET |
---|---|---|---|---|---|---|---|
1 | RGD3128-P2-002 | Intel Desktop LGA1700 65~125W | 88 x 88 x 25 | 0.207 (@40CFM) | N/A | Skived Copper Heat Sink | Data Sheet |
2 | RGD3128VCL-P-002 | Intel Desktop LGA1700 125W (min.) | 90 x 90 x 25 | 0.150 (@40CFM) | N/A | Stacked Aluminum Fin with Vapor Chamber Base | Data Sheet |
3 | RGD3128VC-P-002 | Intel Desktop LGA1700 125W (min.) | 90 x 90 x 25 | 0.125 (@40CFM) | N/A | Stacked Copper Fin with Vapor Chamber Base | Data Sheet |
There's no data. |