THERMAL

CPU Coolers / Server CPU Coolers / Intel Socket LGA3647 series (Sky Lake/ Xeon Gold, Platinum available) BACK

Intel Socket LGA3647 series (Sky Lake/ Xeon Gold, Platinum available)

Product Series -
1U & 2U Coolers, TDP : 205 Watts to 250 Watts

Features & Benefits -
A full range of products, high quality, high reliability, lower noise level, long term supply, customization available

Target Market -
Server based IPC, Sever, Storage, Medical, Telecommunication

P/N : RG9223

Outline Dimension : 108 x78 x 64.5m
Heat Sink : Aluminum Stacked Fin with Heat Pipe Integrated
Fan : 60 x 60 x 25 mm, Two Ball Bearing, 6500RPM, Noise Level : 52dB(A)
Connector Type : 2543-4P
Thermal Resistance : 0.164 ℃/W > 165W, 0.192 ℃/W > 205W
Weight : 460 g

P/N: RG9110-P

Outline Dimension : 108 x 78 x 25.5mm
Heat Sink : Aluminum Stacked Fin, Copper Base with Heat Pipes
TDP: 205 watts
Weight : 225 g

P/N: RG9120-P

Outline Dimension : 108 x 78 x 25.5mm
Heat Sink : Copper Stacked Fin, Copper Base with Heat Pipes
TDP: 225 watts
Weight : 355 g

P/N: RG9210-P

Outline Dimension : 108 x 78 x 64mm
Heat Sink : Aluminum Stacked Fin, Copper Base, with Heat Pipes Integrated
TDP: 250 watts
Weight : 418 g

Intel Socket LGA3647 series (Sky Lake/ Xeon Gold, Platinum available)

NO Part NumberCPU SocketOutline Dimension (mm)Rth (℃/W)Fan Spec.Heat Sink Material DATA SHEET
1RG9223Intel LGA3647
205W
108 x 78 x 64.50.19260x60x25mm/ 4way/ 6500 RPM/ 52dB(A)Aluminum Stacked Fin
with Heat Pipe
Data Sheet
2RG9110-PIntel LGA3647
205W
108 x 78 x 25.5depends on airflow usedN/AAluminum Stacked Fin
with Copper Base
with Heat Pipes
Data Sheet
3RG9120-PIntel LGA3647
225W
108 x 78 x 25.5depends on airflow usedN/ACopper Stacked Fin
with Copper Base
with Heat Pipes
Data Sheet
4RG9210-PIntel LGA3647
250W
108 x 78 x 64depends on airflow usedN/AAluminum Stacked Fin
with Copper Base
with Heat Pipes
Data Sheet
There's no data.