/ Mobile & Embedded CPU Coolers / Intel Mobile 41x41 series (for Bay Trail, Braswell, Apollo Lake, Elkhart Lake) BACK

Intel Mobile 41x41 series (for Bay Trail, Braswell, Apollo Lake, Elkhart Lake)

Product Series -
1U Coolers, TDP : 10 Watts to 25 Watts

Features & Benefits -
High quality, high reliability, lower noise level, long term supply, customization available

Target Market -
Automation Computer, Point of Sale, Embedded Board, Gaming, Kiosk, Digital Healthcare

P/N : RG7111-B3-A

Outline Dimension : 50 x 50 x 28mm
Heat Sink : Extruded Aluminum Radial Fin
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6800 RPM, Noise Level : 33 dB(A)
Connector Type : 2510-3P
Thermal Resistance : 1.05 ℃/W
Weight : 58 g

P/N : RG7111-B4-A (for Tiger Lake/ TGL-UP4)

Outline Dimension : 50 x 50 x 28mm
Heat Sink : Extruded Aluminum Radial Fin
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 31 dB(A)
Connector Type : 2543-4P
Thermal Resistance : 0.97 ℃/W
Weight : 58 g

P/N : RG7110-B-4

Outline Dimension : 53.3 x 53.3 x 22.5 mm
Heat Sink : Extruded Aluminum Line Fin
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 31 dB(A)
Connector Type : 2543-4P
Thermal Resistance : 1.25 ℃/W
Weight : 43 g

P/N : RG7120-B

Outline Dimension : 53.3 x 53.3 x 22.3 mm
Heat Sink : Stacked Fin Copper
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 25 dB(A)
Connector Type : 2510-3P
Thermal Resistance : 0.99 ℃/W
Weight : 86 g

Intel Mobile 41x41 series (for Bay Trail, Braswell, Apollo Lake, Elkhart Lake)

NO Part NumberCPU SocketOutline Dimension(mm)Rth ℃/WFan Spec.Heat Sink Material DATA SHEET
1RG7111-B3-AIntel Mobile50 x 50 x281.0540x40x10mm 3way 6800 RPM 33dB(A)Extruded AluminumData Sheet
2RG7111-B4-AIntel Mobile50 x 50 x 280.9740x40x10mm 4way 6000 RPM 31dB(A)Extruded AluminumData Sheet
3RG7110-B-4Intel Mobile53.3 x 53.3 x 22.51.2540x40x10mm 4way 6000 RPM 31dB(A)Extruded AluminumData Sheet
4RG7120-BIntel Mobile53.3 x 53.3 x 22.50.9940x40x10mm 3way 6000 RPM 25dB(A)Stacked fins/ CopperData Sheet
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