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Tailor-made IoT series

Features & Benefits -
-Cooler type & size, fully customized, with TDP ranged from 10 Watts to 20 Watts
-Best fit size & performance, One-Stop-Design support by REGO’s thermal RD team
-Cost saving by semi-customization from our available standard molds.


Please note that not all of products/molds are listed and shown here. If you are unable to locate the product you're looking for, don't hesitate to reach us for more info or requests.

ALExx30-1331xxx

Application: 5G M.2 Cooler
Upper Fan Heat Sink : 30(W) x 13.1(H) x 44mm or Optional
Lower Heat Sink : 34(W) x 9.4(H) x 44mm or Optional
Heat Sink : Extruded Aluminum
Fan : 30 x 30 x 10 mm, Two ball Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional

ALExx44-1430xxx

Application : RF Tester Cooler
Outline Dimension : 44(W) x 13.5(H) x Optional(L) mm
Heat Sink : Extruded Aluminum
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional

ALE59xx-0924xxx

Application : FPGA Cooler
Outline Dimension : 59.4(W) x 9.3(H) x Optional(L) mm
Heat Sink : Extruded Aluminum
Fan : 40 x 40 x 6 mm, Hypro Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional

Tailor-made IoT series

NO Part NumberCPU SocketOutline Dimension (mm)Rth (℃/W)Fan SpecHeat Sink Material DATA SHEET
1ALExx30-1331xxx5G M.2Upper Fan Heat Sink : 30(W) x 13.1(H) x 44(L)/ Optional
Lower Heat Sink 34(W) x 9.4(H) x 44(L)/ Optional
Axial 3010Extruded aluminumData Sheet
2ALExx44-1430xxxFPGA44(W) x 13.5(H) x Optional(L)Axial 4010Extruded AluminumData Sheet
3ALE59xx-0924xxxRF59.4(W) x 9.3(H) x Optional(L)Axial 4006Extruded aluminumData Sheet
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