Thermal Flow Simulation_Case study A_Step 1

Application : Industrial Computer
Outline:294.6 x 188 x 61 mm
heat source=(CPU)35W
Ta=40℃
Fanless, Natural convection
Thermal pad,K=17





Top Cover
1、Top Cover-AL6063,292x188x14mm
2、heat pipe-ø6 mm x 2 pcs
3、Block-AL6063,73x25x35.05mm

Simulation Result :
Ta=40℃ CPU Tj=90.74℃