THERMAL

Tailor Made Thermal Modules / Rego's Thermal Flow Simulation Service / Thermal Flow Simulation_Case Study A BACK

Thermal Flow Simulation_Case Study A

Application : Gaming Machine
Natrual convection
CPU TDP : 7 watts ( AMD CPU )
TA : 50 deg C
Thermal Design Target : CPU TJ = 90 deg C
Initial CPU TJ : 96 deg C with an extruded Heat Sink





Simulation Result:
1: We design 5 types of heat sinks and done the thermal flow simulations .
2: The results of CPU Tj are Extrusion 96.6 deg C / Skive 94.3 deg C / Stamp 93.9 deg C / Forge-line fin 93.1 / Forge-pin fin 91.43 deg C respectively.
3: We find out the Forge-pin fin heat sink as optimal thermal solution for this gaming machine.